Hydrosilex Cutting Compound is the latest formulation of diminishing abrasives providing a medium cut & finish polish for hologram-free results. Engineered specifically for use with dual-action or random orbital polishers. the abrasives break down very consistently to produce the highest depth of gloss. Hydrosilex Cutting Compound is water-based and contains no solvents, like silicones, fillers or petroleum. No dust is produced during polishing which makes for easy clean up and prolongs the life of the polishing pads.
Shake Before Use. Apply 5-6 drops onto the buffing pad for a 2x2 area. Spread across working area before turning on buffer. Maintain a slow tempo and arm speed. Do not work overwork product until dry. Keep surface area lubricated with compound.